Conductive paste is, as the name suggests, an electrically conductive adhesive. Harima’s Extensive knowledge acquired in the fields of coating and adhesion resins has made it possible for us to
create conductive paste that, for example, facilitates the release of heat generated by electronic
devices (thermal conductivity) to allow for higher density of parts to be mounted. Also
characterized by its high reliability and compatibility with various printing methods, conductive
paste has become an indispensable soldering material in the parts assembly of next-generation
electronics devices such as solar cells and smart phones.

Another of our conductive paste is NanoPaste, a stable distribution of nano-sized* metallic particles in ink-form that only needs to be applied and heated to form a highly reliable metallic membrane
for a wide-range of joint and wiring applications. NanoPaste’s applicability to various printing
methods, including ink-jet, has made it a prime candidate as a core material in the new area of
printed electronics.

Harima Chemicals’ Silver Nano Particle> Stable distribution is achieved by controlling the dispersion agents.

Silver Paste with thermal conductivity

	Feature	Product name	Viscosity	Curing Condition	PDF
Silver (Ag) Nano Particle Voidless Joint High Joint Reliability	NH-3000D	High thermal conductivity	17 Pa・s	190℃×90min
	NH-4000	Low temperature curing	20 Pa・s	150℃×90min
	SHB-200	Direct joining with Ni under pressurized process		250℃×60min

Copper Paste for through-hole

	Feature	Product name	Viscosity	Curing Condition	PDF
Highly Reliable Electromigration Resistance Applicable for various boards	CP-800S	Automotive applications	3.5 Pa・s	–
	CP-1000S		–	–

Copper paste for electrode

	Feature	Product name	Viscosity	Curing Condition	PDF
Cost savings and performances Ag	CP-5000D	Electrode parts

Nano particle ink series

	Feature	Product name	Viscosity	Curing Condition	PDF
Silver (Ag) Nano Particle Ink Excellent Adhesion Inkjet printing Ag/Silver Ink Conductive nano particle ink	NPS-L	Inkjet Printing	9mPa.s	220℃×60min
	NPS-L-HB	Screen Printing	120 Pa.s	200℃×30min
	NPG-J	Inkjet Printing