Harima offers a wide variety of solder paste to meet the requirements of technologically advanced automotive and consumer electronics industry. Harima’s unique state of the art innovation in flux chemistry increases the reliability and durability of automotive electronics, and hence, keep us safe on the road. With the advent of new technologies and legal and environmental requirement, Harima relentlessly makes effort to live up to the very high standards of today’s world. Harima offers below solder paste to satisfy the need of various industries:

●High reliable lead-free (SAC 305) solder paste for automotive application ●Halogen free solder paste for 0402 chip ●Low silver solder paste for 0402 chip ●Conductive paste ●Copper paste for through hole ●Nano paste

Application	Feature	Product name	Alloy composition	Powder size	PDF
Automotive	Standard for Automotive	GSP	Sn-3.0Ag-0.5Cu	20-38
	Excellent Printability	AMP		20-38
	Washable&Void-less	ECOHAT		20-32
	Highly Durability	LSP	Sn-3.5Ag-0.7Cu-Bi+α Sn-1.1Ag-0.6Cu-Bi+β	20-38
	Tin-Lead Standard	ANI-1	Sn-37Pb	25-45	–
	Tombstone Improved	TR-5	Sn-36Pb-2Ag	25-45	–
Consumer Electronics	Pb-free Standard	HVS	Sn-3.0Ag-0.5Cu	20-38 15-25
	Halogen-free (No halogen)	NH5		20-38 10-20
	Silver less (0.1Ag) Low Silver (1.1Ag)	HLS	Sn-0.1Ag-0.7Cu-2.0Bi+γ Sn-1.1Ag-0.7Cu-1.7Bi+δ	20-38 15-25